Three different thermal configurations

There is a different thermal configuration for each of the following:

  • PowerBook G4 (17-inch Double-Layer SD)
  • PowerBook G4 (17-inch 1.67GHz)
  • PowerBook G4 (17-inch 1.5GHz) and PowerBook G4 (17-inch 1.33GHz) See the appropriate heading, below.

Warning: Whenever the logic board is separated from the heatsink, the thermal material must be replaced. Failure to do so can cause the computer to overheat and be damaged.

Important: Avoid unnecessary contact with new thermal material, as dirt and body oils reduce the thermal material's conductivity.

Note: After installing new thermal material, if you must briefly re-separate the logic board from the heatsink, it is OK to retain the same, new material.

PowerBook G4 (17-inch Double-Layer SD):

  1. Use a black stick to remove all the original thermal material on the heatsink at all three mating surface locations shown below.
  2. Clean off remaining residue with an alcohol pad.
Powerbook Titanium Thermal Pads

Note: X23 thermal grease (included with the logic board) is used for all three heatsink mating surfaces.

3. Use 1 syringe for each pad to apply a daub of thermal grease in the center of all three mating surfaces, as shown below. Make sure it is centered.

PowerBook G4

PowerBook G4

Ibook Inch

PowerBook G4 (17-inch 1.67GHz):

  1. Use a black stick to remove all the original thermal material on the heatsink at all three mating surface locations shown below.
  2. Clean off remaining residue with an alcohol pad.

Notes:

  • G751 thermal grease (922-6495) is used for all three heatsink mating surfaces.
  • One syringe of thermal grease (922-6495) contains 0.5 cubic centimeter (cc) and is graduated in ml/cc. A milliliter (ml) equals a cubic centimeter (cc).
  • The photo below is for illustration only and may not show your heatsink configuration.
  1. Apply 0.3 cubic centimeters (cc) thermal grease (922-6495) in the center of the raised mating surface (A) for the CPU chip, as shown below. Make sure it is centered and no less than the specified amount, as the CPU chip generates the most heat.
  2. Apply 0.3 cc thermal grease in the center of the raised mating surface (B).
  3. Apply 0.6 cc of thermal grease in an "X" pattern from corner to corner of the mating surface (C), and then cross the center of the "X" with one line of grease the width of the center raised surface, as shown right and below.
Powerbook Inch

PowerBook G4 (17-inch 1.5GHz) and PowerBook G4 (17-inch 1.33GHz):

  1. Use a black stick to remove all the original thermal material on the heatsink at all three mating surface locations shown below.
  2. Clean off remaining residue with an alcohol pad.
  3. Center and install a new thermal pad onto the heatsink at the CPU mating surface, as shown below.

Important: If the thermal pad kit includes two same-size pads, apply them, with the backing removed, one on top of the other as a double layer.

If thermal pads have a backing material, remove one side before applying to the heatsink.

Center that side over the mating surface (raised surface) and evenly apply it, without air pockets, by lightly pressing. Remove any remaining backing. (The picture shown is for illustration only.)

Important: With an razor knife, trim any excess thermal pad material, if any, that extends beyond the mating surface, to prevent it from touching holes in the heatsink.

Notes:

  • A 2.5 cc foil packet of thermal gel may be included with the replacement logic board.
  • The 10 cubic centimeter (cc) syringe (922-5929) may be graduated in milliliters (ml). A milliliter (ml) equals a cubic centimeter (cc).
  • If applying the thermal gel from the 10 cc dispenser, remove the end cap and push the plunger until the gel reaches the front opening. Note the position of the end of the plunger in the tube. Dispense the gel until the plunger end moves about 1/3 to 1/2 of 1 cc (ml). The plunger will move back slightly when pressure is released, so push it slightly beyond the amount to be dispensed.
  1. On the center mating surface of the heatsink, apply approximately 0.3 to 0.5 (1/3 to 1/2) cubic centimeter (cc) of T630 thermal gel, as shown below.
  2. On the mating surface for the graphics chip (right side), apply approximately 0.3 (1/3) cc's to each of the four outer corners and approximately 0.5 (1/2) cc's to the center, as shown.

For all PowerBooks:

1. If the logic board was removed to facilitate another procedure and will be reinstalled, also remove all the thermal material from each of the three corresponding chips (shown below) in the same manner. Note: Only one model shown for illustration.

Important: Use extreme care not to damage the chips or logic board components.

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